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Home > Products >  3,3'-(4-METHYL-1,3-PHENYLENE) BIS (1,1-DIMETHYLUREA)

3,3'-(4-METHYL-1,3-PHENYLENE) BIS (1,1-DIMETHYLUREA) CAS NO.17526-94-2

  • FOB Price: USD 500 /Kilogram Get Latest Price
  • Min.Order: 25 Kilogram
  • Payment Terms: T/T,Other
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    standard(20-100)Kilogramstandard(50-100)KilogramReagent(5-10)Kilogram

  • Product Details

Keywords

  • 3,3'-(4-METHYL-1,3-PHENYLENE) BIS (1,1-DIMETHYLUREA)
  • 17526-94-2
  • 3,3'-(4-METHYL-1,3-PHENYLENE) BIS (1,1-DIMETHYLUREA)

Quick Details

  • ProName: 3,3'-(4-METHYL-1,3-PHENYLENE) BIS (1,1...
  • CasNo: 17526-94-2
  • Molecular Formula: C13H20N4O2
  • Appearance: asked
  • Application: Epoxy resin curing agent
  • DeliveryTime: After payment
  • PackAge: On Request
  • Port: shanghai qingdao
  • ProductionCapacity: 20 Kilogram/Day
  • Purity: 95%-98%
  • Storage: Dry, ventilated, room temperature
  • Transportation: by air or sea
  • LimitNum: 25 Kilogram
  • Operating Temperature: 40
  • Valid Period: 0
  • Shear Strength: 0
  • Curing Time: 0

Superiority

The epoxy resin curing agent chemically reacts with the epoxy resin to form a network-like solid polymer, and the composite material is encased in the mesh body. An additive that turns a linear resin into a tough, bulk solid. Includes multiple types. Epoxy floor is mostly used in underground garage floor, cheap and practical

 

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Details

classification
 
Folding alkaline
 
Basic curing agent WTF: including aliphatic diamines and polyamines, aromatic polyamines, other nitrogen-containing compounds and modified fatty amines.
 
Folded acid
 
Acidic curing agent: includes organic acids, acid anhydrides, and boron trifluoride and complexes thereof.
 
Folding and forming
 
Addition curing agent: This kind of curing agent reacts with epoxy group to form a part of the segment of the cured product, and crosslinks the linear molecule into a bulk structure molecule by stepwise polymerization. This kind of curing agent is also called melon type curing agent. .
 
Folding catalytic type
 
Catalytic curing agent: This kind of curing agent only initiates the epoxy resin. After the epoxy group is opened, the epoxy resin itself is polymerized into a network structure to form a homopolymer having an ether bond as a main structure.
 
Folding display type
 
The obvious curing agent is a commonly used curing agent, and can be further classified into an addition polymerization type and a catalytic type. The addition polymerization type is a ring in which an epoxy group is opened to carry out an addition polymerization reaction, and the curing agent itself participates in a three-dimensional network structure. Such a curing agent, if added in too small amount, is bonded to the final reacted epoxy group. Therefore, for such curing agents, there is a suitable amount. The catalytic curing agent cyclically adds and polymerizes the epoxy group in a cationic manner or an anionic manner. Finally, the curing agent does not participate in the network structure, so there is no suitable amount of equivalent reaction; however, the dosage is increased. Speed up the curing. Among the obvious curing agents, dicyandiamide and adipic acid dihydrazide are insoluble in epoxy resin at room temperature, and start to solidify after being dissolved at a high temperature, and thus exhibit a latent state. Therefore, it can be called a functional latent curing agent.
 
Folding latent type
 
The latent curing agent refers to the relatively long-term stability at room temperature after mixing with the epoxy resin (the epoxy resin is generally required to be more than 3 months, which has a large practical value, and most preferably requires half a year or more. ), and only need to be exposed to heat, light, moisture, etc., the curing reaction begins. Such curing agents essentially block the curing agent activity physically and chemically. Therefore, in some books, these varieties are also classified as latent curing agents, which may actually be referred to as functional latent curing agents. Because the latent curing agent can be mixed with epoxy resin to make a liquid type complex, simplifying the matching procedure of epoxy resin application, its application range from single-pack adhesive to coating, impregnating varnish, potting compound, powder coating, etc. Aspect development. Latent curing agents have attracted more and more attention in foreign countries. It can be said that it is a key topic of research and development. Various new curing agents and new technologies are emerging, which are very active.
 
Folding amine curing agent
 
The curing action of the primary and secondary amines on the epoxy resin is to open the epoxy group by the active hydrogen on the nitrogen atom to crosslink and solidify. Aliphatic polyamines such as ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, and diethylaminopropylamine have higher activities, and can crosslink and cure epoxy resin at room temperature; while aromatic polyamines are more active. Low, such as m-phenylenediamine, can be cured at 150 ° C to complete.
 
Folding anhydride curing agent
 
Dibasic acids and their anhydrides such as maleic anhydride and phthalic anhydride can cure epoxy resins, but must be baked at higher temperatures to cure completely. The acid anhydride first reacts with a hydroxyl group in the epoxy resin to form a monoester, and the carboxyl group in the monoester is esterified with an epoxy group to form a diester.
 
Folded synthetic resin curing agent
 
The low molecular weight polyamide resin is an amber viscous resin formed by reacting a linoleic acid dimer or a tung oil dimer with an aliphatic polyamine such as ethylenediamine or diethylenetriamine. The resin structure prepared from dimerized linoleic acid and ethylenediamine is as follows:
 
Folding latent curing agent
 
This curing agent is stable under normal conditions, but when heated to a certain temperature, its activity is revealed to cure the epoxy resin. Such as dicyandiamide, mixed with epoxy resin, is stable at room temperature. If it is at 145-165 ° C, the epoxy resin can be cured in 30 minutes. The boron trichloride ethylamine complex is stable at room temperature and cures the epoxy resin at temperatures above 100 °C.

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